进迭时空 (SpacemiT) 高性能 AI CPU 芯片K3挂两个LPDDR5参考板PCB 原理图 datasheet checklist等
Key Stone K3 是由 RISC-V 计算芯片企业 进迭时空 (SpacemiT) 推出的高性能 AI CPU 芯片，属于 SpacemiT Stone 系列中的 Key Stone 家族。它是全球首款符合 RVA23 规范配置文件的高性能 RISC-V AI CPU 。以下是该芯片的核心规格与特点：核心硬件规格[*]架构设计：采用 RISC-V 同构融合计算技术。
[*]CPU 核心：集成 8个 高性能计算大核 X100。
[*]主频最高可达 2.4GHz。
[*]单个 CPU 核心性能等效于 ARM-A76。
[*]提供 130 KDMIPS 的通用算力 。
[*]AI 加速单元：集成 8个 超宽并行计算 AI 核 A100。
[*]提供 60 TOPS 的通用 AI 算力 。
[*]内存支持：支持最高 32GB 内存容量 。
主要能力与应用场景
[*]端侧大模型运行：凭借强大的算力，K3 芯片能够流畅运行参数规模高达 300亿 (30B) 的大语言模型 (LLM)，满足端侧复杂 AI 应用需求 。
[*]应用领域：
[*]AI 计算机
[*]智能机器人（如人形机器人的运动控制与智能决策）
[*]个人智算服务器
[*]边缘智算服务器
[*]大模型推理机
PCB 原理图
其他资料
REFDESCOMP_DEVICE_TYPECOMP_VALUESYM_NAME
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D4113DIODE_SCHOTTKY_SOD2-P2_32-1_8X1_35-H1_0_BAT54HT1GBAT54HT1GSOD2-P2_32-1_8X1_35-H1_0
D4115ESD_BI-DIR_ESD0402_ESDESDESD0402
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U12534SY8386J_QFN17-P0_45-3_7X3_7-H0_65_SY8386JSY8386JQFN17-P0_45-3_7X3_7-H0_65
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文档最好打包一下，:) 进迭时空 (SpacemiT) 高性能 :):):):) 不知道需要多久才能制作 good good study,day day up 谢谢分享
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