Allegro DRC 錯誤代碼Dictionary of DRC Error Marker Codes

mikeduh · 发表于 2024-1-22 12:30

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DRC错误标记由带有两个字母的“领结”符号组成。字母代码指示违反了哪种约束类型。
Net-to-Net Spacing DRC错误标记代码为大写；相反，Same Net Spacing代码是小写的。
DRC错误标记代码定义
下表列出了每种DRC错误标记代码组合及其关联的约束违例。该列表根据DRC错误标记中的字母按字母顺序排列。

Code	ConstraintViolation
A – A	Acuteangle to cavity edge
B – B	BondPad to Bond Pad
B – L	BondPad to Line
B – S	BondPad to Shape
C – C	Componentto cavity edge
	Package to package
	Soldermask to soldermask
D – C	DFAPackage to package
D – D	MechanicalDrill Hole to Mechanical Drill Hole
	Mechanical Drill Hole to Drill Hole
	Drill Hole to Drill Hole
D – I	Negativeplane islands
D – L	MechanicalDrill Hole to Cline
D – L	Drill Hole to Cline
D – P	PhaseTolerance Tolerance
	Mechanical Drill Hole to Pin
	Drill Hole to Pin
D – S	MechanicalDrill Hole to Shape
D – S	Drill Hole to Shape
D – V	MechanicalDrill Hole to Via
D – V	Drill Hole to Via
E – D	MaxFinal Settle Max
	Min First Switch Min
	Noise Margin Min
	Overshoot Max
	Propagation Delay Max
	Propagation Delay Min
	Propagation Delay Path Type
	Relative Propagation Delay Delta
	Relative Propagation Delay Path Type
	Relative Propagation Delay Scope
E – L	LayerSets
	Max Exposed Length
	Total Etch Length Max
	Total Etch Length Min
E – P	Parallelism
E – S	MaxStub Length
E – T	VerifySchedule
E – V	MaxVia Count
E – X	ActiveWindow
	Max Xtalk
	Max Peak Xtalk
	Sensitive Window
	Maximum Inter Crosstalk
	Maximum Intra Crosstalk
F – C	Bondfinger to component
	Bond Pad to Component Edge
	Bond Finger to cavity edge
F – F	BondPad to Bond Pad (same net)
F – F	Bond Pad to Bond Pad (different net)
I – M	Single-lineImpedance Target and Tolerance
J – N	AllowTs
K – B	BondPad to Route Keepin
	Bond Pad to Route Keepout
	Bond Pad to Via Keepout
K – C	Packageto place keepin
K – C	Package to place keepout
K – L	Lineto Route Keepin
K – L	Line to Route Keepout
K – P	ThruPin to Route Keepin
	Thru Pin to Route Keepout
	SMD to Route Keepin
	SMD to Route Keepout
	Test Pin to Route Keepin
	Test Pin to Route Keepout
	Test Pin to No Probe
K – S	Shapeto Route Keepin
K – S	Shape to Route Keepout
K – V	Viato Route Keepin
	Via to Route Keepout
	Via to Via Keepout
	BB Via to Route Keepin
	BB Via to Route Keepout
	BB Via to Via Keepout
	Test Via to Route Keepin
	Test Via to Route Keepout
	Test Via to Via Keepout
	Test Via to No Probe
L – L	Lineto Line
L – S	Shapeto Line
L – W	LineWidth Max
	Line Width Min
	Neck Max Length
	Neck Min Width
M – A	Soldermaskalignment
	Pad Soldermask Alignment
	Symbol Soldermask Alignment
M – C	SymbolSoldermask to Pad Soldermask
M – C	Minimum Cavity Size
M – L	Soldermaskto pad and cline
M – M	PadSoldermask to Pad Soldermask
M – M	Any Metal to Any Metal Spacing
M – P	Soldermaskto Pin
M – S	Soldermaskto shape
M – V	Soldermaskto Via
M – V	Matched Via count violation
N – S	NegativePlane to Sliver
O – C	Objectexposure to cavity
P – B	BondPad to SMD Pin
	Bond Pad to Test Pin
	Bond Pad to Thru Pin
P – D	MechanicalPin Antipad to Drill Hole
P – L	Lineto SMD Pin
	Line to Test Pin
	Line to Thru Pin
	Mechanical Pin Antipad to Cline
P – M	Pastemaskpad to pastemask pad
P – M	Pastemask to package pastemask
P – P	SMDPin to SMD Pin
	SMD Pin to Test Pin
	Test Pin to Test Pin
	Thru Pin to SMD Pin
	Thru Pin to Test Pin
	Thru Pin to Thru Pin
	Mechanical Pin Antipad to Pin
P – S	Shapeto SMD Pin
	Shape to Test Pin
	Shape to Thru Pin
	Mechanical Pin Antipad to Shape
P – V	SMDPin to BB Via
	SMD Pin to Test Via
	SMD Pin to Thru Via
	Test Pin to BB Via
	Test Pin to Test Via
	Test Pin to Thru Via
	Thru Pin to BB Via
	Thru Pin to Test Via
	Thru Pin to Thru Via
	Mechanical Pin Antipad to Via
R – C	Packageto room
S – N	AllowEtch
S – S	Shapeto Shape
T – C	Testpointloc. to component
	Testpoint pad to component
	Testpoint under component
V – B	BondPad to BB Via
	Bond Pad to Test Via
	Bond Pad to Thru Via
V – G	AllowPad-Pad Connect
	BB Via Stagger Max
	BB Via Stagger Min
	Min BB Via Gap
V – L	Lineto BB Via
	Line to Test Via
	Line to Thru Via
V – N	Vias
V – N	Vialist constraint violation
V – S	Shapeto BB Via
	Shape to Test Via
	Shape to Thru Via
V – V	BBVia to BB Via
	BB Via to Test Via
	Test Via to Test Via
	Thru Via to BB Via
	Thru Via to Test Via
	Thru Via to Thru Via
W – A	Min.bonding wire length
W – A	Wire to die edge angle
W – D	Bondingwire diameter
W – C	Wireto Cavity Edge Spacing
W – C	Wire End to Cavity Edge Spacing
W – E	Wireend to wire end
W – F	Wireto bond finger
W – I	Max.bonding wire length
W – P	Wireto pin
W – W	Wireto wire (same profile)
W – X	Wireto wire (different profile)
X – D	ExternallyDetermined Violation